Website
www.bondlend.com Go →
Head office
225 Liberty Street
10th Floor
Suite 1020
New York
NY 10281
+1 212 901 2289
BondLend
BondLend is a securities finance technology platform created specifically to support the fixed income borrowing, lending and repo community. BondLend's trading and financing services provide straight-through processing automation for borrowing, lending and repo using a common standards-based protocol and infrastructure processing eliminating manual processes, freeing up valuable resources.
BondLend comparison services add efficiency and reduce the risk of potential collateral management errors. Comparison services are security type agnostic and support global usage for cash and non-cash records. BondLend's trading and post-trade services help drive down unit costs and increase efficiency. It allows firms to free up resources to expand their market presence, increase trading volumes, and reduce error rates all without additional cost.
Contacts
Paul Lynch
Managing director, global head of products
+1 212 901 2281
paul.lynch@equilend.com
Dan Dougherty
Managing director, global head of CRM, sales & marketing
+1 212 901 2248
dan.dougherty@equilend.com
Additional addresses
New York (Midtown)
575 Fifth Ave. 21st Floor, New York, NY 10017 USA
+1 212 901 2200
Boston
33 Arch Street, 17th Floor, Boston, MA 02111
+1 857 800 9551
Toronto
100 University Avenue, Floor 5, Toronto, ON M5J 1V6, Canada
+1 416 865 3395
London
36th Floor, One Canada Square, London E14 5AA UK
+44 20 7426 4426
Dublin
South Point, Harmony Row, Dublin, D2, Ireland
+353 1961 9280
Hong Kong
Suite 1603, 16th Floor, Central Tower, 28 Queens Road Central, Central, Hong Kong
+852 3622 3988
Tokyo
Marunouchi Kitaguchi Building 10F, 1-6-5 Marunouchi Chiyoda-ku, Tokyo
+81 50 3579 3335
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